2 filled coaxial through-silicon-via (TSV) - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding. 2 filled coaxial through-silicon-via (TSV). IEICE Electronic Express, 10(24):20130894, 2013. [doi]

This author has not been identified. Look up 'Fengjuan Wang' in GoogleThis author has not been identified. Look up 'Zhangming Zhu' in GoogleThis author has not been identified. Look up 'Yintang Yang' in GoogleThis author has not been identified. Look up 'Xiaoxian Liu' in GoogleThis author has not been identified. Look up 'Ruixue Ding' in Google

runs on WebDSL