U. Weber, M. Schumacher, J. Lindner, O. Boissière, P. Lehnen, S. Miedl, P. K. Baumann, G. Barbar, C. Lohe, T. McEntee. AVD:::®::: technology for deposition of next generation devices. Microelectronics Reliability, 45(5-6):945-948, 2005. [doi]
@article{WeberSLBLMBBLM05,
title = {AVD:::®::: technology for deposition of next generation devices},
author = {U. Weber and M. Schumacher and J. Lindner and O. Boissière and P. Lehnen and S. Miedl and P. K. Baumann and G. Barbar and C. Lohe and T. McEntee},
year = {2005},
doi = {10.1016/j.microrel.2004.11.019},
url = {http://dx.doi.org/10.1016/j.microrel.2004.11.019},
tags = {C++},
researchr = {https://researchr.org/publication/WeberSLBLMBBLM05},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {45},
number = {5-6},
pages = {945-948},
}