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U. Weber, M. Schumacher, J. Lindner, O. Boissière, P. Lehnen, S. Miedl, P. K. Baumann, G. Barbar, C. Lohe, T. McEntee. AVD:::®::: technology for deposition of next generation devices. Microelectronics Reliability, 45(5-6):945-948, 2005. [doi]