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Artificial Intelligence of Things Enabled Fungiculture in Shipping Container

Boon Siong Wee, Cheng Siong Chin, Anurag Sharma. Artificial Intelligence of Things Enabled Fungiculture in Shipping Container. In Shu-Ching Chen, Her-Terng Yau, Roland Stenzel, Hsiung-Cheng Lin, editors, 24th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD Winter 2022, Taichung, Taiwan, December 7-9, 2022. pages 115-119, IEEE, 2022. [doi]

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Boon Siong Wee

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Cheng Siong Chin

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Anurag Sharma

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