Boon Siong Wee, Cheng Siong Chin, Anurag Sharma. Artificial Intelligence of Things Enabled Fungiculture in Shipping Container. In Shu-Ching Chen, Her-Terng Yau, Roland Stenzel, Hsiung-Cheng Lin, editors, 24th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD Winter 2022, Taichung, Taiwan, December 7-9, 2022. pages 115-119, IEEE, 2022. [doi]
@inproceedings{WeeCS22,
title = {Artificial Intelligence of Things Enabled Fungiculture in Shipping Container},
author = {Boon Siong Wee and Cheng Siong Chin and Anurag Sharma},
year = {2022},
doi = {10.1109/SNPD54884.2022.10051780},
url = {https://doi.org/10.1109/SNPD54884.2022.10051780},
researchr = {https://researchr.org/publication/WeeCS22},
cites = {0},
citedby = {0},
pages = {115-119},
booktitle = {24th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD Winter 2022, Taichung, Taiwan, December 7-9, 2022},
editor = {Shu-Ching Chen and Her-Terng Yau and Roland Stenzel and Hsiung-Cheng Lin},
publisher = {IEEE},
isbn = {979-8-3503-1041-2},
}