BEoL Reliability, XPS and REELS Study on low-k Dielectrics to understand Breakdown Mechanisms

B. Wehring, R. Hoffmann, L. Gerlich, M. Czernohorsky, B. Uhlig, R. Seidel, T. Barchewitz, F. Schlaphof, Lutz Meinshausen, C. Leyens. BEoL Reliability, XPS and REELS Study on low-k Dielectrics to understand Breakdown Mechanisms. In 2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020. pages 1-5, IEEE, 2020. [doi]

Authors

B. Wehring

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R. Hoffmann

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L. Gerlich

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M. Czernohorsky

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B. Uhlig

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R. Seidel

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T. Barchewitz

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F. Schlaphof

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Lutz Meinshausen

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C. Leyens

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