A Novel Method Based on Deep Convolutional Neural Networks for Wafer Semiconductor Surface Defect Inspection - researchr publication

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Guojun Wen, Zhijun Gao, Qi Cai, Yudan Wang, Shuang Mei. A Novel Method Based on Deep Convolutional Neural Networks for Wafer Semiconductor Surface Defect Inspection. IEEE T. Instrumentation and Measurement, 69(12):9668-9680, 2020. [doi]

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