Eduardo P. Wiechmann, Pablo Aqueveque, Jorge A. Henriquez, Anibal S. Morales. An intercell busbar topology to improve resilience to anomalies of copper electrorefining process. In 2016 IEEE Industry Applications Society Annual Meeting, Portland, OR, USA, October 2-6, 2016. pages 1-6, IEEE, 2016. [doi]
Abstract is missing.