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Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

Paul Wild, T. Grozinger, Dominik Lorenz, A. Zimmermann. Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates. IEEE Transactions on Reliability, 66(4):1229-1237, 2017. [doi]

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Paul Wild

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T. Grozinger

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Dominik Lorenz

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A. Zimmermann

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