Paul Wild, T. Grozinger, Dominik Lorenz, A. Zimmermann. Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates. IEEE Transactions on Reliability, 66(4):1229-1237, 2017. [doi]
@article{WildGLZ17,
title = {Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates},
author = {Paul Wild and T. Grozinger and Dominik Lorenz and A. Zimmermann},
year = {2017},
doi = {10.1109/TR.2017.2759231},
url = {https://doi.org/10.1109/TR.2017.2759231},
researchr = {https://researchr.org/publication/WildGLZ17},
cites = {0},
citedby = {0},
journal = {IEEE Transactions on Reliability},
volume = {66},
number = {4},
pages = {1229-1237},
}