A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing - researchr publication authors

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G. Williams, Patrick O Hara, J. Moore, B. Gordon, J. Rose. A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1, IEEE, 2009. [doi]

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