Thermal Aware Module Placement for Heterogeneous 3D-IC Based FPGAs - researchr publication authors

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Alexander Wold, Dirk Koch, Jim Torresen. Thermal Aware Module Placement for Heterogeneous 3D-IC Based FPGAs. In 2013 IEEE International Symposium on Parallel & Distributed Processing, Workshops and Phd Forum, Cambridge, MA, USA, May 20-24, 2013. pages 281-286, IEEE, 2013. [doi]

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