Alexander Wold, Dirk Koch, Jim Torresen. Thermal Aware Module Placement for Heterogeneous 3D-IC Based FPGAs. In 2013 IEEE International Symposium on Parallel & Distributed Processing, Workshops and Phd Forum, Cambridge, MA, USA, May 20-24, 2013. pages 281-286, IEEE, 2013. [doi]
@inproceedings{WoldKT13-0,
title = {Thermal Aware Module Placement for Heterogeneous 3D-IC Based FPGAs},
author = {Alexander Wold and Dirk Koch and Jim Torresen},
year = {2013},
doi = {10.1109/IPDPSW.2013.32},
url = {http://doi.ieeecomputersociety.org/10.1109/IPDPSW.2013.32},
researchr = {https://researchr.org/publication/WoldKT13-0},
cites = {0},
citedby = {0},
pages = {281-286},
booktitle = {2013 IEEE International Symposium on Parallel & Distributed Processing, Workshops and Phd Forum, Cambridge, MA, USA, May 20-24, 2013},
publisher = {IEEE},
}