Ingrid De Wolf, K. Croes, O. Varela Pedreira, Riet Labie, A. Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne. Cu pumping in TSVs: Effect of pre-CMP thermal budget. Microelectronics Reliability, 51(9-11):1856-1859, 2011. [doi]
@article{WolfCPLRPVOVB11,
title = {Cu pumping in TSVs: Effect of pre-CMP thermal budget},
author = {Ingrid De Wolf and K. Croes and O. Varela Pedreira and Riet Labie and A. Redolfi and M. Van De Peer and Kris Vanstreels and C. Okoro and Bart Vandevelde and Eric Beyne},
year = {2011},
doi = {10.1016/j.microrel.2011.06.003},
url = {http://dx.doi.org/10.1016/j.microrel.2011.06.003},
researchr = {https://researchr.org/publication/WolfCPLRPVOVB11},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {51},
number = {9-11},
pages = {1856-1859},
}