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Cu pumping in TSVs: Effect of pre-CMP thermal budget

Ingrid De Wolf, K. Croes, O. Varela Pedreira, Riet Labie, A. Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne. Cu pumping in TSVs: Effect of pre-CMP thermal budget. Microelectronics Reliability, 51(9-11):1856-1859, 2011. [doi]

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