An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth - researchr publication authors

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Dong Hyuk Woo, Nak Hee Seong, Dean L. Lewis, Hsien-Hsin S. Lee. An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth. In Matthew T. Jacob, Chita R. Das, Pradip Bose, editors, 16th International Conference on High-Performance Computer Architecture (HPCA-16 2010), 9-14 January 2010, Bangalore, India. pages 1-12, IEEE Computer Society, 2010. [doi]

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