An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth

Dong Hyuk Woo, Nak Hee Seong, Dean L. Lewis, Hsien-Hsin S. Lee. An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth. In Matthew T. Jacob, Chita R. Das, Pradip Bose, editors, 16th International Conference on High-Performance Computer Architecture (HPCA-16 2010), 9-14 January 2010, Bangalore, India. pages 1-12, IEEE Computer Society, 2010. [doi]

@inproceedings{WooSLL10,
  title = {An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth},
  author = {Dong Hyuk Woo and Nak Hee Seong and Dean L. Lewis and Hsien-Hsin S. Lee},
  year = {2010},
  doi = {10.1109/HPCA.2010.5416628},
  url = {http://dx.doi.org/10.1109/HPCA.2010.5416628},
  tags = {optimization, architecture},
  researchr = {https://researchr.org/publication/WooSLL10},
  cites = {0},
  citedby = {0},
  pages = {1-12},
  booktitle = {16th International Conference on High-Performance Computer Architecture (HPCA-16 2010), 9-14 January 2010, Bangalore, India},
  editor = {Matthew T. Jacob and Chita R. Das and Pradip Bose},
  publisher = {IEEE Computer Society},
  isbn = {978-1-4244-5659-8},
}