Interconnect and package design of a heterogeneous stacked-silicon FPGA - researchr publication authors

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Ephrem Wu, Khaldoon Abugharbieh, Bahareh Banijamali, Suresh Ramalingam, Paul Wu, Chris Wyland. Interconnect and package design of a heterogeneous stacked-silicon FPGA. In Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, San Jose, CA, USA, September 22-25, 2013. pages 1-8, IEEE, 2013. [doi]

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