Interconnect and package design of a heterogeneous stacked-silicon FPGA

Ephrem Wu, Khaldoon Abugharbieh, Bahareh Banijamali, Suresh Ramalingam, Paul Wu, Chris Wyland. Interconnect and package design of a heterogeneous stacked-silicon FPGA. In Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, San Jose, CA, USA, September 22-25, 2013. pages 1-8, IEEE, 2013. [doi]

@inproceedings{WuABRWW13,
  title = {Interconnect and package design of a heterogeneous stacked-silicon FPGA},
  author = {Ephrem Wu and Khaldoon Abugharbieh and Bahareh Banijamali and Suresh Ramalingam and Paul Wu and Chris Wyland},
  year = {2013},
  doi = {10.1109/CICC.2013.6658402},
  url = {http://dx.doi.org/10.1109/CICC.2013.6658402},
  researchr = {https://researchr.org/publication/WuABRWW13},
  cites = {0},
  citedby = {0},
  pages = {1-8},
  booktitle = {Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, San Jose, CA, USA, September 22-25, 2013},
  publisher = {IEEE},
}