Thermosiphon: A thermal aware NUCA architecture for write energy reduction of the STT-MRAM based LLCs

Bi-Wu, Yuanqing Cheng, Pengcheng Dai, Jianlei Yang, Youguang Zhang, Dijun Liu, Ying Wang, Weisheng Zhao. Thermosiphon: A thermal aware NUCA architecture for write energy reduction of the STT-MRAM based LLCs. In 2017 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2017, Irvine, CA, USA, November 13-16, 2017. pages 474-481, IEEE, 2017. [doi]

@inproceedings{WuCDYZLWZ17,
  title = {Thermosiphon: A thermal aware NUCA architecture for write energy reduction of the STT-MRAM based LLCs},
  author = {Bi-Wu and Yuanqing Cheng and Pengcheng Dai and Jianlei Yang and Youguang Zhang and Dijun Liu and Ying Wang and Weisheng Zhao},
  year = {2017},
  doi = {10.1109/ICCAD.2017.8203815},
  url = {https://doi.org/10.1109/ICCAD.2017.8203815},
  researchr = {https://researchr.org/publication/WuCDYZLWZ17},
  cites = {0},
  citedby = {0},
  pages = {474-481},
  booktitle = {2017 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2017, Irvine, CA, USA, November 13-16, 2017},
  publisher = {IEEE},
  isbn = {978-1-5386-3093-8},
}