Guanghua Wu, Meixian Jiang. Study on the Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive. IEEE Access, 7:171923-171933, 2019. [doi]
@article{WuJ19a,
title = {Study on the Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive},
author = {Guanghua Wu and Meixian Jiang},
year = {2019},
doi = {10.1109/ACCESS.2019.2956648},
url = {https://doi.org/10.1109/ACCESS.2019.2956648},
researchr = {https://researchr.org/publication/WuJ19a},
cites = {0},
citedby = {0},
journal = {IEEE Access},
volume = {7},
pages = {171923-171933},
}