Study on the Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive

Guanghua Wu, Meixian Jiang. Study on the Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive. IEEE Access, 7:171923-171933, 2019. [doi]

Abstract

Abstract is missing.