Meng-Chiou Wu, Rung-Bin Lin. Reticle floorplanning of flexible chips for multi-project wafers. In John Lach, Gang Qu, Yehea I. Ismail, editors, Proceedings of the 15th ACM Great Lakes Symposium on VLSI 2005, Chicago, Illinois, USA, April 17-19, 2005. pages 494-497, ACM, 2005. [doi]
Abstract is missing.