Wafer Packing for Full Mask Exposure Fabrication

Ching-Ting Wu, Andrew Lim, David Hung-Chang Du. Wafer Packing for Full Mask Exposure Fabrication. In ICCAD. pages 52-55, 1991.

@inproceedings{WuLD91,
  title = {Wafer Packing for Full Mask Exposure Fabrication},
  author = {Ching-Ting Wu and Andrew Lim and David Hung-Chang Du},
  year = {1991},
  researchr = {https://researchr.org/publication/WuLD91},
  cites = {0},
  citedby = {0},
  pages = {52-55},
  booktitle = {ICCAD},
}