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Ching-Ting Wu, Andrew Lim, David Hung-Chang Du. Wafer Packing for Full Mask Exposure Fabrication. In ICCAD. pages 52-55, 1991.
Possibly Related PublicationsThe following publications are possibly variants of this publication: On Wafer-Packing ProblemsDavid Hung-Chang Du, Ichiang Lin, K. C. Chang. TC, 42(11):1382-1388, 1993. Chip placement in a reticle for multiple-project wafer fabricationMeng-Chiou Wu, Rung-Bin Lin, Shih-Cheng Tsai. todaes, 13(1), 2008. [doi]
The following publications are possibly variants of this publication: