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Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages

Yuelin Wu, K. N. Subramanian, Scott Calabrese Barton, Andre Lee. Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages. Microelectronics Reliability, 78:355-361, 2017. [doi]

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