Jie Wu, Songbai Xue, Jingwen Wang, Jianxin Wang. Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments. Microelectronics Reliability, 79:124-135, 2017. [doi]
@article{WuXWW17-0,
title = {Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments},
author = {Jie Wu and Songbai Xue and Jingwen Wang and Jianxin Wang},
year = {2017},
doi = {10.1016/j.microrel.2017.10.020},
url = {https://doi.org/10.1016/j.microrel.2017.10.020},
researchr = {https://researchr.org/publication/WuXWW17-0},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {79},
pages = {124-135},
}