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Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments

Jie Wu, Songbai Xue, Jingwen Wang, Jianxin Wang. Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments. Microelectronics Reliability, 79:124-135, 2017. [doi]

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