Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects

Zhenyu Wu, Yintang Yang, ChangChun Chai, Yuejin Li, JiaYou Wang, Jing Liu, Bin Liu. Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects. Microelectronics Reliability, 48(4):578-583, 2008. [doi]

Abstract

Abstract is missing.