Jian-Ming Wu, Tzong-Lin Yang, Yuan-Chih Lin, Min-Lang Yang. Arrangement of Vias to Connect a PCB Ground Plane in a Common-Source Amplifier. In International Symposium on Intelligent Signal Processing and Communication Systems, ISPACS 2021, Hualien City, Taiwan, November 16-19, 2021. pages 1-2, IEEE, 2021. [doi]
Abstract is missing.