A study in flip-chip UBM/bump reliability with effects of SnPb solder composition - researchr publication authors

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J. D. Wu, P. J. Zheng, C. W. Lee, S. C. Hung, J.-J. Lee. A study in flip-chip UBM/bump reliability with effects of SnPb solder composition. Microelectronics Reliability, 46(1):41-52, 2006. [doi]

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