A study in flip-chip UBM/bump reliability with effects of SnPb solder composition

J. D. Wu, P. J. Zheng, C. W. Lee, S. C. Hung, J.-J. Lee. A study in flip-chip UBM/bump reliability with effects of SnPb solder composition. Microelectronics Reliability, 46(1):41-52, 2006. [doi]

Abstract

Abstract is missing.