Yu Xia, Yuhao Huang, Mingfei Liu, Jie Wang, Zheng Li, Yuemin Li, Yunqi Fu, Chao Xiang. 3D Silicon Nitride Waveguide Interposers for High-Density Scale-up Chiplet Interconnects. In European Conference on Optical Communications, ECOC 2025, Copenhagen, Denmark, September 28 - Oct. 2, 2025. pages 1-4, IEEE, 2025. [doi]
Abstract is missing.