An 11.6aF/kPa Mechanical Stress Sensor With 0.808% Temperature-Drift Oscillator for Flip-Chip Packaging

Lanxiang Xiao, Lei Chen, Fengwei An. An 11.6aF/kPa Mechanical Stress Sensor With 0.808% Temperature-Drift Oscillator for Flip-Chip Packaging. IEEE Trans. Circuits Syst. II Express Briefs, 70(2):391-395, February 2023. [doi]

Authors

Lanxiang Xiao

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Lei Chen

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Fengwei An

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