Lanxiang Xiao, Lei Chen, Fengwei An. An 11.6aF/kPa Mechanical Stress Sensor With 0.808% Temperature-Drift Oscillator for Flip-Chip Packaging. IEEE Trans. Circuits Syst. II Express Briefs, 70(2):391-395, February 2023. [doi]
@article{XiaoCA23,
title = {An 11.6aF/kPa Mechanical Stress Sensor With 0.808% Temperature-Drift Oscillator for Flip-Chip Packaging},
author = {Lanxiang Xiao and Lei Chen and Fengwei An},
year = {2023},
month = {February},
doi = {10.1109/TCSII.2022.3176278},
url = {https://doi.org/10.1109/TCSII.2022.3176278},
researchr = {https://researchr.org/publication/XiaoCA23},
cites = {0},
citedby = {0},
journal = {IEEE Trans. Circuits Syst. II Express Briefs},
volume = {70},
number = {2},
pages = {391-395},
}