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Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints

Pan Xiao, Meng Xiao, Nian Cai, Baojun Qiu, Shuai Zhou, Han Wang. Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints. IEEE T. Instrumentation and Measurement, 72:1-12, 2023. [doi]

Authors

Pan Xiao

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Meng Xiao

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Nian Cai

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Baojun Qiu

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Shuai Zhou

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Han Wang

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