Pan Xiao, Meng Xiao, Nian Cai, Baojun Qiu, Shuai Zhou, Han Wang. Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints. IEEE T. Instrumentation and Measurement, 72:1-12, 2023. [doi]
@article{XiaoXCQZW23,
title = {Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints},
author = {Pan Xiao and Meng Xiao and Nian Cai and Baojun Qiu and Shuai Zhou and Han Wang},
year = {2023},
doi = {10.1109/TIM.2023.3235435},
url = {https://doi.org/10.1109/TIM.2023.3235435},
researchr = {https://researchr.org/publication/XiaoXCQZW23},
cites = {0},
citedby = {0},
journal = {IEEE T. Instrumentation and Measurement},
volume = {72},
pages = {1-12},
}