Qingyun Xie, Mengyang Yuan, John Niroula, Bejoy Sikder, Shisong Luo, Kai Fu, Nitul S. Rajput, Ayan Biswas Pranta, Pradyot Yadav, Yuji Zhao, Nadim Chowdhury, Tomás Palacios. Towards DTCO in High Temperature GaN-on-Si Technology: Arithmetic Logic Unit at 300 °C and CAD Framework up to 500 °C. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]
@inproceedings{XieYNSLFRPYZCP23,
title = {Towards DTCO in High Temperature GaN-on-Si Technology: Arithmetic Logic Unit at 300 °C and CAD Framework up to 500 °C},
author = {Qingyun Xie and Mengyang Yuan and John Niroula and Bejoy Sikder and Shisong Luo and Kai Fu and Nitul S. Rajput and Ayan Biswas Pranta and Pradyot Yadav and Yuji Zhao and Nadim Chowdhury and Tomás Palacios},
year = {2023},
doi = {10.23919/VLSITechnologyandCir57934.2023.10185364},
url = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185364},
researchr = {https://researchr.org/publication/XieYNSLFRPYZCP23},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023},
publisher = {IEEE},
isbn = {978-4-86348-806-9},
}