Architectural benefits and design challenges for three-dimensional integrated circuits

Jing Xie, Jishen Zhao, Xiangyu Dong, Yuan Xie. Architectural benefits and design challenges for three-dimensional integrated circuits. In 2012 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2010, Kuala Lumpur, Malaysia, December 6-9, 2010. pages 540-543, IEEE, 2010. [doi]

@inproceedings{XieZDX10,
  title = {Architectural benefits and design challenges for three-dimensional integrated circuits},
  author = {Jing Xie and Jishen Zhao and Xiangyu Dong and Yuan Xie},
  year = {2010},
  doi = {10.1109/APCCAS.2010.5775083},
  url = {http://dx.doi.org/10.1109/APCCAS.2010.5775083},
  researchr = {https://researchr.org/publication/XieZDX10},
  cites = {0},
  citedby = {0},
  pages = {540-543},
  booktitle = {2012 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2010, Kuala Lumpur, Malaysia, December 6-9, 2010},
  publisher = {IEEE},
  isbn = {978-1-4244-7454-7},
}