Daniel H. Xing, Ankur Srivastava 0001. 3D-Aware Low Power High-level Resource Binding and Co-Design. In Pascal Meinerzhagen, Kapil Dev, Jerald Yoo, editors, Proceedings of the 29th ACM/IEEE International Symposium on Low Power Electronics and Design, ISLPED 2024, Newport Beach, CA, USA, August 5-7, 2024. pages 1-6, ACM, 2024. [doi]
Abstract is missing.