Bowen Xing, Bin Zhou, Jin Wang, Bo Hou, Xiang Li, Qi Wei, Rong Zhang. A Novel Packaging Stress Isolation Chip for MEMS Devices. In 2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019. pages 1-3, IEEE, 2019. [doi]
@inproceedings{XingZWHLWZ19,
title = {A Novel Packaging Stress Isolation Chip for MEMS Devices},
author = {Bowen Xing and Bin Zhou and Jin Wang and Bo Hou and Xiang Li and Qi Wei and Rong Zhang},
year = {2019},
doi = {10.1109/SENSORS43011.2019.8956845},
url = {https://doi.org/10.1109/SENSORS43011.2019.8956845},
researchr = {https://researchr.org/publication/XingZWHLWZ19},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019},
publisher = {IEEE},
isbn = {978-1-7281-1634-1},
}