A Novel Packaging Stress Isolation Chip for MEMS Devices

Bowen Xing, Bin Zhou, Jin Wang, Bo Hou, Xiang Li, Qi Wei, Rong Zhang. A Novel Packaging Stress Isolation Chip for MEMS Devices. In 2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019. pages 1-3, IEEE, 2019. [doi]

Abstract

Abstract is missing.