Constraint driven I/O planning and placement for chip-package co-design

Jinjun Xiong, Yiu-Chung Wong, Egino Sarto, Lei He. Constraint driven I/O planning and placement for chip-package co-design. In Fumiyasu Hirose, editor, Proceedings of the 2006 Conference on Asia South Pacific Design Automation: ASP-DAC 2006, Yokohama, Japan, January 24-27, 2006. pages 207-212, IEEE, 2006. [doi]

@inproceedings{XiongWSH06,
  title = {Constraint driven I/O planning and placement for chip-package co-design},
  author = {Jinjun Xiong and Yiu-Chung Wong and Egino Sarto and Lei He},
  year = {2006},
  doi = {10.1145/1118299.1118356},
  url = {http://doi.acm.org/10.1145/1118299.1118356},
  tags = {constraints, design},
  researchr = {https://researchr.org/publication/XiongWSH06},
  cites = {0},
  citedby = {0},
  pages = {207-212},
  booktitle = {Proceedings of the 2006 Conference on Asia South Pacific Design Automation: ASP-DAC 2006, Yokohama, Japan, January 24-27, 2006},
  editor = {Fumiyasu Hirose},
  publisher = {IEEE},
  isbn = {0-7803-9451-8},
}