A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging

Pengfei Xu, Chaowei Si, Yurong He, Zhenyu Wei, Lu Jia, Guowei Han, Jin Ning, Fuhua Yang. A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging. Sensors, 21(19):6428, 2021. [doi]

Abstract

Abstract is missing.