Efficient variation-aware EM-semiconductor coupled solver for the TSV structures in 3D IC - researchr publication authors

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Yuanzhe Xu, Wenjian Yu, Quan Chen, Lijun Jiang, Ngai Wong. Efficient variation-aware EM-semiconductor coupled solver for the TSV structures in 3D IC. In Wolfgang Rosenstiel, Lothar Thiele, editors, 2012 Design, Automation & Test in Europe Conference & Exhibition, DATE 2012, Dresden, Germany, March 12-16, 2012. pages 1409-1412, IEEE, 2012. [doi]

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