Yuanzhe Xu, Wenjian Yu, Quan Chen, Lijun Jiang, Ngai Wong. Efficient variation-aware EM-semiconductor coupled solver for the TSV structures in 3D IC. In Wolfgang Rosenstiel, Lothar Thiele, editors, 2012 Design, Automation & Test in Europe Conference & Exhibition, DATE 2012, Dresden, Germany, March 12-16, 2012. pages 1409-1412, IEEE, 2012. [doi]
@inproceedings{XuYCJW12,
title = {Efficient variation-aware EM-semiconductor coupled solver for the TSV structures in 3D IC},
author = {Yuanzhe Xu and Wenjian Yu and Quan Chen and Lijun Jiang and Ngai Wong},
year = {2012},
url = {http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=6176583},
researchr = {https://researchr.org/publication/XuYCJW12},
cites = {0},
citedby = {0},
pages = {1409-1412},
booktitle = {2012 Design, Automation & Test in Europe Conference & Exhibition, DATE 2012, Dresden, Germany, March 12-16, 2012},
editor = {Wolfgang Rosenstiel and Lothar Thiele},
publisher = {IEEE},
isbn = {978-1-4577-2145-8},
}