A 256 Gbps Heterogeneously Integrated Silicon Photonic Microring-based DWDM Receiver Suitable for In-Package Optical I/O

Zhe Xuan, Ganesh Balamurugan, Duanni Huang, Ranjeet Kumar, Jahnavi Sharma, Cooper Levy, Jinyong Kim, Chaoxuan Ma, Guan-Lin Su, Songtao Liu, Xinru Wu, Tolga Acikalin, Haisheng Rong, James E. Jaussi. A 256 Gbps Heterogeneously Integrated Silicon Photonic Microring-based DWDM Receiver Suitable for In-Package Optical I/O. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]

@inproceedings{XuanBHKSLKMSLWA23,
  title = {A 256 Gbps Heterogeneously Integrated Silicon Photonic Microring-based DWDM Receiver Suitable for In-Package Optical I/O},
  author = {Zhe Xuan and Ganesh Balamurugan and Duanni Huang and Ranjeet Kumar and Jahnavi Sharma and Cooper Levy and Jinyong Kim and Chaoxuan Ma and Guan-Lin Su and Songtao Liu and Xinru Wu and Tolga Acikalin and Haisheng Rong and James E. Jaussi},
  year = {2023},
  doi = {10.23919/VLSITechnologyandCir57934.2023.10185280},
  url = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185280},
  researchr = {https://researchr.org/publication/XuanBHKSLKMSLWA23},
  cites = {0},
  citedby = {0},
  pages = {1-2},
  booktitle = {2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023},
  publisher = {IEEE},
  isbn = {978-4-86348-806-9},
}