Songbai Xue, Yuxiu Wu, Zongjie Han, Ling Zhang. Effects of lead widths and pitches on reliability of soldered joints and optimum simulation for QFP devices. In Hamid R. Arabnia, editor, Proceedings of the 2006 International Conference on Computer Graphics & Virtual Reality, CGVR 2006, Las Vegas, Nevada, USA, June 26-29, 2006. pages 168-174, CSREA Press, 2006.
Abstract is missing.