Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive - researchr publication authors

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Xingjun Xue, Shujie Yang, Dong Wu, Liyang Pan, Zheyao Wang. Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive. In 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016. pages 1-3, IEEE, 2016. [doi]

This author has not been identified. Look up 'Xingjun Xue' in GoogleThis author has not been identified. Look up 'Shujie Yang' in GoogleThis author has not been identified. Look up 'Dong Wu' in GoogleThis author has not been identified. Look up 'Liyang Pan' in GoogleThis author has not been identified. Look up 'Zheyao Wang' in Google

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