Xingjun Xue, Shujie Yang, Dong Wu, Liyang Pan, Zheyao Wang. Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive. In 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016. pages 1-3, IEEE, 2016. [doi]
@inproceedings{XueYWPW16,
title = {Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive},
author = {Xingjun Xue and Shujie Yang and Dong Wu and Liyang Pan and Zheyao Wang},
year = {2016},
doi = {10.1109/ICSENS.2016.7808438},
url = {https://doi.org/10.1109/ICSENS.2016.7808438},
researchr = {https://researchr.org/publication/XueYWPW16},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016},
publisher = {IEEE},
isbn = {978-1-4799-8287-5},
}